Raysees in-house designed and developed light source chips are a reflection of the core technologies of our company. These optical chips are the essential components of lighting devices and are being used in our own light source products. We have top-class light chip design professionals with strong technical expertise. Our team of experts has significant industrial experience in the structural design of VCSEL/EEL epitaxy and optimization of the industrial process.
Here at Raysees, we do not believe that designing light source chips means only building production houses in mainland China and replicating existing technologies. Our core aim is to resolve specific problems for the prospective customers of consumer electronics. Focusing on VCSEL chip design, our technologies aim to resolve the following issues:
How to avoid patent infringement and have continuous invention simultaneously for start-up companies like Raysees as the patent portfolios are mainly possessed by a few industrial giants?
How to advance 3D optical sensing by reducing both the size and cost of light source chips?
How to deal with various customers’ needs regarding photonic chips with a global standard?
How to simplify optical integration as well as ensure optimized performance and reliable safety?
As mass production carries more challenges to optical chip design and packaging, how do we maintain constant stability and reliability of the products?
Mass Production Technology
With a strong emphasis on the above-mentioned issues, Raysees have developed relevant technologies on RFU, IMX, and UPG alongside consistent patent portfolio strategy. As a fabless firm, Raysees maintain friendly collaboration with well-known OEM factories. Our OEM management team comprises employees with more than 15 years of experience in mass production and OEM management.
At present, we have proved our ability of mass production on hundreds of 6-inch wafers using our in-house VCSEL epitaxy technology. With optical power ranging from several milli Watts to several Watts and wavelength at both 850nm and 940nm, our light source products will be employed into various industry-leading lighting products and different application scenarios, such as 3D vision, face recognition, security surveillance, driving assistance, and many more.
Raysees proposed the concept of the high chip-to-packaging ratio for the first time in the industry. Similar to the screen-to-body ratio for smartphones, the area used by the light chip to the packaging substrate is an important factor to determine the integrity of the packaging. It is a demanding packaging technique to get light source products with minute sizes by efficiently decreasing the required area for packaging.
The high chip-to-packaging ratio technology does not just simply take a smaller substrate to replace one with normal size but also considers various factors such as heat dissipation, power consumption, and general performance. With the delicate design of packaging workflow and material development, the size of our light source items with a high chip-to-packaging ratio can be exceptionally decreased. Besides, it also maintains equal thermal resistance or even less than the light source products having normal packaging size. The small-scale packaging at chip-level can profoundly streamline the workload of the design and integration of optical systems, which give greater flexibility to customer electronics. Also, the reasonable pricing of our innovative light source products will offer higher profits to our customers.
Figure: Comparison between a light source product with normal packaging (Left)
and that with the high chip-to-packaging ratio (Right) by Raysees.
Raysees is the pioneer and innovator of 1.5th optical integration technology or 1.5th optics. Unlike the primary and secondary optics, 1.5th optics only keeps the packaging size of the primary optics while uses the light rays efficiently as the large secondary optics. This can be regarded as a reliable optical integration at the component-level. Besides, FRay™ Infrared LED light source empowered by Raysees proprietary 1.5th optics packaging technique offers a wide range of benefits to 3D optical sensing applications requiring flood illumination, such as smart security, face recognition, and biometric identification. Raysees core aim is to bring revolutionary change and progress to 3D face recognition devices using structured light technology, on both cost reduction and performance enhancement.
Figure:Comparison between LED with the primary secondary optics (left and middle) and that with the 1.5th-optics technology by Raysees.
Reduced Packaging - Cost-Effective
1.5th optical integration technology works equally as the conventional primary and secondary optics. But its packaging size is highly reduced which makes it more suitable for the development of smaller sized consumer electronics. The reduced packaging sizes efficiently decrease the usage of packaging materials and reduce the packaging workload, therefore systematically decrease the cost of the light source products. Besides, there is no need to spend extra money on the installation and alignment of the secondary optics as the alignment of the light chips and the optical lens has already been done during the component-level packaging process. So, 1.5th optics plays an effective role in saving excessive cost due to extra equipment and product defect rate.
Figure: FRay™ series of flood illumination LEDs for 3D optical sensing.
Top-Notch Flooding Pattern
At present, with the partnership with the dealers of famous 3D sensing systems and solutions, Raysees FRay™ series products have been tested on product performance and lighting reliability. In contrast to traditional LEDs previously used by the dealers, FRay™ series light source offers the best flooding pattern with high uniformity and brightness, particularly for long working distance at about 60cm, as shown in the figure below. By illuminating the same plaster bust, FRay™ series can capture more details of the head with greater uniformity and brightness.
Figure: Comparison of the effects of flood illumination between conventional LEDs and FRay™ series by Raysees. (Distance at 60cm)
Diverse Application Scenarios
Raysees proprietary 1.5th optical integration technology offers additional choices for semi-conductor light source products with its enhanced performance, reasonable cost and high reliability. As a component-level packaging technology, the 1.5th optics can be widely used for LED and VCSEL packaging. Presently, our light source products, equipped with this optical integration technology, have been successfully employed into a wide range of devices such as commercial lighting, iris recognition, 3D vision, and many more.
Figure:The size of commercial lighting product equipped with 1.5th-optics by Raysees (below) will be highly reduced compared with that of conventional optical solutions (above).
Optical Sensing System
An optical sensing solution is a complex optical system which integrates light source chips, optical lens, sensors and algorithms to meet the requirements of a particular application scenario. With the development and expansion of artificial intelligence, and AR/VR, the need of optical sensing technique for applications emerges at an increasing rate. Therefore, the light source chip plays a vital role to fulfill the growing demands of various optical sensing applications.
How Does Optical System Work?
In an optical sensing system, there are strong relationships between different parts including light chips, optical lens and algorithms. Thus, it requires much experience and an in-depth understanding about the functioning of each specific part. This enables the smooth and reliable functioning of the optical system with the best performance and at the lowest possible power consumption.
Limitations of Conventional Optical System
Conventionally, an optical system depends on supply chains to source all the components before their integration into working system which is expensive and time-consuming. Besides, concerning cost reduction and mass production, light products in market rise to follow worldwide configurations and lack flexibility to meet the specific needs of the customers. However, once the customer’s need is modified, it is much likely that the entire existing solution would be overthrown and revived.
Raysees Optical System Optimization
To resolve this issue and deliver customized solutions with more flexibility to the customers, Raysees founded professional teams of hardware, software and algorithms utilizing independent light chip design and optical integration technology. The core aim is to to provide our customers complete optical sensing solutions such as biometric identification, security surveillance, autonomous driving and robotics. Because of our powerful in-house R&D, Raysees products can be free of limitation of the global products on the market and relieve the dependence on supply chains. So, we can supply more flexible solutions to customers in short time. This advantage of our independent R&D on light chips, optical integration and algorithms not only lessens the cost and power consumption on the products, but also reduces the modification time of an ongoing project if any revision is requested by a customer. With years of experience in technical innovation and product development, Raysees aim to remove unnecessary barriers between different areas of industry. The goal is to form a closed-loop with the idea of 'solution to meet the customer needs and the customer needs to optimize solution.'