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VCSEL Chips
VCSEL Core Technologies and Innovations
Here at Raysees,we not only believe that designing VCSEL merely means replicating existing technologies,
but also converting VCSEL technolocies into manufacturabl products,
breaking through certain bottle necks, such as performance limitation,
mass production stability, high reliability and application expansion.
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Epitaxial Design
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Device Design
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Electromagnetic Simulation
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Thermal Management
Our Technologies Aim to Resolve the Following Issues
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Use the VCSEL performance capabilities andprovide solutions to various optical sensingapplications.
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As mass production brings on more challenges toVCSEL design and packaging processes, how do wemaintain constant stabilty and reliability of theproducts?
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How to simplify optical integration with VCSEL toensure optimized performance and reliability ofoptical sensing systems?
Highlights
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Automotive 2D Addressable VCSEL
Pixel-level control
for robust LiDAR -
High-Density Random Array VCSEL
<24 µm pitch
higher density -
Narrow-Divergence VCSEL
<15° beam angle
highly integrated optical systems -
Polarized VCSEL
Stable polarization
high SNR -
Flip-Chip VCSEL
On-chip microlens shaping
high-SNR sensing -
Multi-Junction VCSEL
Ultra-high optical power density
for compact system design -
Red VCSEL
Visible wavelength range for
diverse health monitoring applications -
Automotive CW VCSEL
Automotive-grade continuous-wave
operation with high reliability
Core Technologies of Raysees VCSEL
With a strong emphasis on the industrial issues, Raysees has developed relevant technologies along with consistent patent portfolio strategy.
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01 2D Addressable VCSEL Technology
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02 Small Divergence VCSEL Technology
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03 Back-Emitting VCSEL with On-substrate Microlens
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04 High Power Density & High Peak Power VCSEL Technology
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05 High-Speed Datacom VCSEL Technology
2D addressable VCSELs enable pixel-level electrical control on a single chip. Compared with conventional arrays with global or segmented emission, they support arbitrary pixel activation, dynamic pattern projection, and programmable timing. Combined with high-uniformity cavity design and high optical power density, they provide a flexible core light source for LiDAR sensing.
Through advanced device structure design and process optimization, beam divergence is reduced to <15° while maintaining high optical power. This minimizes optical crosstalk, ensures clear transmit/receive paths, enables more compact sensor modules, and improves ranging accuracy.
Flip-chip back-emitting VCSELs offer faster rise/fall times under pulsed operation, enabling higher peak power. Monolithic microlens integration enhances optical performance while reducing module thickness, ideal for space-constrained devices such as smartphones and AR/VR systems.
Delivers multiple-fold higher optical output without increasing chip size, with improved PCE over conventional VCSELs. A key enabler for high-power, long-range sensing applications such as 3D dToF and LiDAR.
High-speed VCSELs serve as core light sources for short-reach interconnects in data centers and AI clusters, primarily in parallel optical links. Optimized for array uniformity, modulation performance, and long-term reliability, they enable scalable bandwidth, controlled power consumption, and stable operation for next-generation optical modules.
Mass Production of Raysees VCSEL
Raysees optimizes VCSEL process flows to enhance optical output power and power conversion efficiency (PCE), while maintaining stable wafer yield. All products have passed environmental and high-temperature reliability testing. Yield is consistently above 90%, with cumulative shipments exceeding 200 million units, ensuring mature and scalable mass production capability.
As a fabless company, Raysees has established strong strategic partnerships with leading global epitaxy and wafer foundries. The team brings end-to-end experience from R&D to high-volume manufacturing across both datacom and consumer VCSELs, with over 15 years of experience in top-tier international companies, ensuring reliable, high-quality delivery.