Wafer Heating Solution-DigiHeat Solutions-Raysees

Wafer Heating Solution

Battery Heating Solution Wafer Heating Solution

Advanced Wafer Heating Solution

Raysees DigiHeat technology delivers uniform, targeted laser heating with real-time temperature sensing, zone control, and closed-loop power regulation — reducing wafer warpage, thermal stress, and non-target heat diffusion.

Intelligent Photothermal Control
Faster Wafer Processing

808nm

±0.2℃ Precision
Digital Zoning

Digital zoning and closed-loop control regulate wafer temperatures, reducing warpage, stress, and variation for higher yield.

Zonal Control

Thermal Stability

＞150℃/s Ramp
Shorter Cycles

Fast photothermal conversion and low thermal inertia enable controlled wafer ramping, shorter process cycles, and higher production throughput.

Rapid Response

Process Acceleration

100℃-800℃ Range Process Coverage

High-power VCSEL arrays, digital light-field control, and closed-loop thermal regulation support wafer heating, drying, and annealing.

Wide Coverage

Flexible Tuning

Wafer Heating, Rebuilt by Light

Higher Photothermal Efficiency

VCSEL-based optical heating delivers rapid wafer temperature ramping, higher throughput, and lower energy consumption through efficient light-to-heat conversion.

Lower Process Risk

Targeted, uniform, non-contact heating reduces wafer surface damage caused by thermal non-uniformity.

Smarter Digital Control

Real-time temperature sensing and closed-loop control dynamically adjust laser power, zonal output, and heating time for higher consistency and yield.

Raysees Partnership